As an electron gas, nitrous oxide is mainly used in the dielectric film process for the development and production of semiconductor optoelectronic devices, and is an irreplaceable key idea gas that directly affects the quality of optoelectronic devices.
The chemical reaction between electronic gas and the object to be etched is required in the etching industrial process. In the etching process of wafer manufacturing, in order to obtain the purpose of directional etching, it is necessary to use electronic special gas to remove the etched part.
Ethylsilicate (TEOS) is used as the raw materials used in semiconductor technology deposition can be used for low pressure chemical vapor deposition (LPCVD) the surface of silica in SiC wafers deposits, ensure the density of the oxide layer medium and SiC wafers adhesion ability, improve the performance of the device and yield, and avoided in order to obtain a certain thickness of oxide layer of the shortcomings of long time high temperature oxidation.
In the semiconductor industry, silane is mainly used to make high-purity polysilicon, silicon dioxide film, silicon nitride film, polysilicon isolation layer, etc.It can also be used to make solar cells, optical fibers and photoelectric sensors.
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